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Wafer Acceptance Test (WAT): After the completion of semiconductor wafer manufacturing, the electrical performance of each Die on the wafer can be tested using a thermal chuck combined with a high-precision temperature control system. This includes IV testing (current voltage characteristic testing), functional testing, and reliability testing at different temperature points to select qualified Dies.

Final Test or Pre bond Test: Prior to chip packaging, by precisely controlling the temperature of the hot card, simulating the working environment of the chip in practical applications, electrical characteristics and functional verification are carried out to ensure that the chip’s performance meets the specification requirements under various temperature conditions.

Burn in Test: In order to accelerate the detection of early faults, the hot chuck will conduct long-term pressure tests on the chip at high temperatures. The integrated temperature control system can quickly adjust and precisely control the temperature, accelerate the aging process of the chip, and improve testing efficiency.

Temperature Cycle Test: Simulates the temperature changes of a chip in different usage environments, detects the thermal stress tolerance and packaging reliability of the chip through rapid and accurate temperature cycling of the thermal chuck, and prevents cracking, delamination, and other issues.

Failure Analysis: After discovering defective products, precise temperature control is used to reproduce specific testing conditions, helping engineers locate the cause of the fault, such as whether the electrical performance degradation or failure is caused by temperature.

R&D and Quality Control: In the process of developing new processes or products, integrated temperature control systems and heat cartridges are used to evaluate the performance of semiconductor devices at different temperatures, optimize design, and ensure product quality and reliability.

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